ZeptoBars - RSS feed http://zeptobars.ru/en/ Microelectronics. Die-shots. Artificial intelligence. Lasers. en-us Tue, 10 Jun 2006 04:00:00 GMT Fri, 24 Oct 14 01:16:37 +0400 webmaster@zeptobars.ru 120 10 <![CDATA[OnSemi MMBT2222A - npn BJT transistor : weekend die-shot]]> http://zeptobars.ru/en/read/OnSemi-MMBT2222A-MMBT2222AL1G-npn-bjt-transistor

Die size 343x343 µm. Comparing to NXP BC847B die area is 1.5 larger (0.118 vs 0.076mm²), but maximum continuous collector current is 6 times higher (600mA vs 100mA, SOT-23 in both cases). This huge increase in current per transistor area is achieved by shunting thin (=high-resistance) base layer with metal. High resistance of base layer is the limiting factor for maximum collector current in BC847B.]]>
Mon, 20 Oct 14 16:42:31 +0400
<![CDATA[NXP 2N7002 N-channel MOSFET : weekend die-shot]]> http://zeptobars.ru/en/read/NXP-2N7002-TrenchMOS-N-Channel-MOSFET
Die size 377x377 µm.

Hexagonal cells of TrenchMOS transistor has 4µm size.
Mon, 20 Oct 14 10:01:37 +0400
<![CDATA[Espressif ESP8266 WiFi-serial interface : weekend die-shot]]> http://zeptobars.ru/en/read/Espressif-ESP8266-wifi-serial-rs232-ESP8089-IoT sold for less than 4$. Chinese company Espressif managed to cram entire WiFi, TCP/IP and HTTP stack into on-chip memory, without external DRAM. Analog front-end requires minimal external components, all filters are internal. All this allowed them to offer extremely aggressive price. Chip has marking ESP8089, which is their more advanced 40nm product. Apparently, they only differ in bonding and ROM content.

Die size 2050x2169 µm, half of which is occupied by transceiver and PA, 25% - on-chip memory (rough size estimations are ~300KiB), and the rest is Xtensa LX106 CPU core and other digital logic.

Chinese engineers did an outstanding job here on finally making WiFi IoT devices cost effective. Let's hope Espressif will eventually open more internal chip information for amateurs and end users. ]]>
Mon, 20 Oct 14 00:32:03 +0400
<![CDATA[Analog Devices AD558 - MIL-Spec 8-bit I²L DAC : weekend die-shot]]> http://zeptobars.ru/en/read/ad558-8bit-dac-laser-trim-analog-devices-cold-war I²L DAC in ceramic package (MIL spec).

It is still an open question how this chip got into ex-USSR/Russia - anonymous reader left no comments on that (this smells like cold war...). It is not a secret that Russia had no extensive civilian IC assortment in manufacturing, hence all military IC's must have been designed and manufactured from scratch (i.e. all R&D, prototypes and masks must be paid by government). In such conditions providing all variety of domestic ICs is economically impossible, at least without government expenses comparable to whole world's expenses on IC R&D. So "temporary", "case-by-case" permit to use imported (both legitimately and not-so-legitimately) western ICs in military equipment "until domestic products are ready" is still here after 24 years despite numerous attempts to end this practice.

Die size 2713x2141 µm, 6µm manufacturing technology, trimming laser was leaving ~8µm diameter spots.

Oh, these rounded resistors are just beautiful... Autorouters in 2014, do you see this?
Note how amount of laser trimming on R-ladder is different for different bits.

PS. Could anyone share position of western engineers on plastic-vs-ceramic package for military/space-grade IC's? It appears modern plastic packages offer more benefits (like better G-shock/vibration reliability and obviously cost) without sacrificing anything (temperature range and moisture are less of a concern now, radiation was never a concern for a package).]]>
Tue, 07 Oct 14 01:52:09 +0400
<![CDATA[74HC4094 - 8-bit shift register : weekend die-shot]]> http://zeptobars.ru/en/read/74HC4094-8bit-shift-register

Sun, 07 Sep 14 01:43:17 +0400
<![CDATA[Atmel AT90USB162 : weekend die-shot]]> http://zeptobars.ru/en/read/atmel-avr-at90usb162

Mon, 25 Aug 14 01:41:49 +0400
<![CDATA[Ti CC1100 (formerly Chipcon) : weekend die-shot]]> http://zeptobars.ru/en/read/Ti-CC1100-chipcon-rf-transceiver

Apparently there are 30 initials of the people, involved in the design of this chip mentioned at the lower right corner. Although this chip was designed after Ti acquisition of Chipcon (that happened in January 2006), it is still marked as Chipcon.

Mon, 18 Aug 14 03:04:11 +0400
<![CDATA[Fairchild NC7SZ57 - universal 2-input gate : weekend die-shot]]> http://zeptobars.ru/en/read/Fairchild-NC7SZ57-UHS-universal-configurable-gate-tinylogic
Die size 416x362 µm, which is the smallest among microchips we've seen.

Comparing to 1-gate NAND2 Ti SN74AHC1G00 - die area here is 1/3 smaller because area below pads is not wasted and used for IO transistors and wiring. It is unclear though how they achieved decent yields (as things there might get damaged during wire bonding) - we can only tell that insulation before last metal is much thicker than usual.

Drop us a message if you have experience or knowledge on getting high-yield logic under pads - this is something we would be interested to have in our own product.

Mon, 04 Aug 14 03:17:39 +0400
<![CDATA[NXP PCA9570 - 4-bit IO expander : weekend die-shot]]> http://zeptobars.ru/en/read/NXP-PCA9570-4bit-io-expander
Die size 589x600 µm.

After (terrible) metal etch - we see IO transistors right under pads:

Tue, 29 Jul 14 08:39:36 +0400
<![CDATA[KILAR KV1084 5A linear regulator : weekend die-shot]]> http://zeptobars.ru/en/read/KILAR-KV1084-5A-linear-regulator
Comparing to LM2940L or LM1117 there are more bonding pads per signal and obviously larger output transistors. Chip was soldered on copper heat spreader to help dissipate 10W+.

Die size 3075x3026 µm.

Sun, 27 Jul 14 15:35:09 +0400