ZeptoBars - RSS feed http://zeptobars.ru/en/ Microelectronics. Die-shots. Artificial intelligence. Lasers. en-us Tue, 10 Jun 2006 04:00:00 GMT Sun, 21 Sep 14 06:00:52 +0400 webmaster@zeptobars.ru 120 10 <![CDATA[74HC4094 - 8-bit shift register : weekend die-shot]]> http://zeptobars.ru/en/read/74HC4094-8bit-shift-register

Sun, 07 Sep 14 01:43:17 +0400
<![CDATA[Atmel AT90USB162 : weekend die-shot]]> http://zeptobars.ru/en/read/atmel-avr-at90usb162

Mon, 25 Aug 14 01:41:49 +0400
<![CDATA[Ti CC1100 (formerly Chipcon) : weekend die-shot]]> http://zeptobars.ru/en/read/Ti-CC1100-chipcon-rf-transceiver

Apparently there are 30 initials of the people, involved in the design of this chip mentioned at the lower right corner. Although this chip was designed after Ti acquisition of Chipcon (that happened in January 2006), it is still marked as Chipcon.

Mon, 18 Aug 14 03:04:11 +0400
<![CDATA[Fairchild NC7SZ57 - universal 2-input gate : weekend die-shot]]> http://zeptobars.ru/en/read/Fairchild-NC7SZ57-UHS-universal-configurable-gate-tinylogic
Die size 416x362 µm, which is the smallest among microchips we've seen.

Comparing to 1-gate NAND2 Ti SN74AHC1G00 - die area here is 1/3 smaller because area below pads is not wasted and used for IO transistors and wiring. It is unclear though how they achieved decent yields (as things there might get damaged during wire bonding) - we can only tell that insulation before last metal is much thicker than usual.

Drop us a message if you have experience or knowledge on getting high-yield logic under pads - this is something we would be interested to have in our own product.

Mon, 04 Aug 14 03:17:39 +0400
<![CDATA[NXP PCA9570 - 4-bit IO expander : weekend die-shot]]> http://zeptobars.ru/en/read/NXP-PCA9570-4bit-io-expander
Die size 589x600 µm.

After (terrible) metal etch - we see IO transistors right under pads:

Tue, 29 Jul 14 08:39:36 +0400
<![CDATA[KILAR KV1084 5A linear regulator : weekend die-shot]]> http://zeptobars.ru/en/read/KILAR-KV1084-5A-linear-regulator
Comparing to LM2940L or LM1117 there are more bonding pads per signal and obviously larger output transistors. Chip was soldered on copper heat spreader to help dissipate 10W+.

Die size 3075x3026 µm.

Sun, 27 Jul 14 15:35:09 +0400
<![CDATA[OPA627, genuine one this time : weekend die-shot]]> http://zeptobars.ru/en/read/BB-TI-OPA627-opamp-genuine-fake Last time we decapped 2 fake OPA627's from ebay: one was remarked AD744 part, another was unidentified remarked BB part.

Recently reader sent us one more OPA627 from ebay. This chip appeared to be genuine.

Die size 2940x2005 µm.

Fri, 25 Jul 14 21:02:13 +0400
<![CDATA[Milandr 1986VE21 : weekend die-shot]]> http://zeptobars.ru/en/read/milandr-1986VE21

Fri, 11 Jul 14 04:05:32 +0400
<![CDATA[KR580VM80A - getting ready for reverse engineering : weekend die-shot]]> http://zeptobars.ru/en/read/kr580vm80a2 first shoot), so that group of enthusiasts (russian only) would be able to recover schematic from it's layout.

A bit more dirt, but less overetch:

Dark field - metal is clearly visible:

Polarized light - metal and vias are visible:

After metallization etch. Any ideas why polysilicon gone?

Thu, 22 May 14 07:19:08 +0400
<![CDATA[Toshiba TCD1201D - linear CCD : weekend die-shot]]> http://zeptobars.ru/en/read/Toshiba-TCD1201D-linear-CCD
Die size 34814x802 µm.

With this die we've reached JPEG limits, full image would be 80k+ pixels wide, so we'll show beginning and the end of the CCD separately:

We are grateful to Kony for this chip.]]>
Sat, 17 May 14 16:45:25 +0400